In a series of articles on full frame cameras, Chipworks covered also the new MAX 24 MP full frame sensor that will be used in the new Leica M and basically described it as a game changer based on the 6µm pixels and 0.11µm/90nm design rules:
“Leica FF CIS will be fabricated by CMOSIS’ foundry partner STMicroelectronics. STMicroelectronics’ IMG175 300 mm Cu process, developed for 1.75 µm mobile CIS, will be adapted to 6 µm pixels and use 0.11 µm design rules for the front end of line (FEOL) processing and 90 nm design rules for the BEOL. While Leica has nowhere near the market share of Japanese FF camera companies, the transition to sub 0.18 µm device production is an event that could possibly alter the product roadmaps and strategies of several companies.”
Image Sensors World called it “the most advanced process node among the full frame sensors vendors“.
